 |
|
CARD
VARNISHING
° Varnish applications
(polyurethanes, epoxy, silicones, acrylics, etc.).
° Varnish
removal (chemical and laser methods).
|
|
SPECIAL
BONDING OPERATIONS
° Definition of materials and processes.
° Bonding in accordance with specific procedures.
° Bonding of heat sinks. |
| |
|
|
| |
|
|
| |
|
|
| |
|
|
CARD
ROBUSTIFICATION BY THICK COATINGS OF POLYMER RESINS
°
This robotized resin-coating process gives integral
.
° No mould is required for this operation.
|
|
HEAT
PROTECTION
° Production of black boxes
(Data backup in hypercritical environments).
|
| |
|
|
|
|
|
|
|
| |
|
|
| |
|
|
| |
|
|
| |
|
|
| |
|
|
| |
|
|
| |
|
|
MOULDING / OVERMOULDING
°
Formulations :
- Development of formulation to specifications.
° Part moulding - from a few grams to several kg.
° Moulding facility:
- Gravity moulding.
- Transfer moulding.
- Moulding under pressure
- Vacuum moulding
- Hot melt mouldingt.
|
|
SHIELDING
° Metal covers.
° Metallized plastic covers. |
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ABSORBERS
° Formulation of laser-cut absorbers.
|
| |
|
|
|
| |
|
|
|
